Sample NameBGA 1.1
Cycle Time (s)39
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

Big decap area. 5 passes. (5 same medium energy passes)

Sample NameBGA 1.2
Cycle Time (s)27
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

Small decap area. 6 passes. (4 medium energy passes, 2 lower energy passes)

Sample NameBGA 1.3
Cycle Time (s)24
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

small decap area. 5 passes. (5 same medium energy passes)

Sample NameBGA 1.4
Cycle Time (s)105
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

This sample is different with 1.1-1.3
big decap area. 13 passes. (10 medium energy passes, 3 lower energy passes)

Sample NameSOT 2.1
Cycle Time (s)3
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

decap area: 2mmx0.9mm
3 passes. (3 same medium energy passes)

Sample NameSOT 2.2
Cycle Time (s)3
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

decap area: 1.9mmx0.8mm
3 passes. (2 medium energy passes, 1 lower energy passes)

Sample NameSOT 2.3
Cycle Time (s)4
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

decap area: 1.9mmx0.8mm
4 passes. (2 medium energy passes, 2 lower energy passes)

Sample NameSOT 2.4
Cycle Time (s)5
Laser Processing TypeLaser Micromachining
IndustrySemicon/Electronics/PCBs
MaterialPlastics/Resins

Application Notes:

decap area: 1.9mmx0.8mm
5 passes. (1 medium energy passes, 4 lower energy passes)

The system we used:

BrandFALIT
ModelICO
Laser SystemICO 40
WorkstationBenchtop
Accessories/Spare PartsN/A

IC Integrated CircuitLED Light Emitting DiodeMEMS Micro Electronic Mechanical SystemPhotonic ChipSensorCPU Computing Processing UnitGPU Graphic Processing UnitNPU Neural Processing UnitFPGA Field Programmable Gate ArraysDSP Digital Signal ProcessingFlash MemoryROM Read Only MemoryRFID Radio Frequency IdentificationAccelerometersGyroscopeTemperature sensorProximity sensorIR sensorPhotonic sensorCMOSCCD Charge-Coupled DeviceDIP : Dual In-line PackageBGA : Ball Grid ArraySoC : System on ChipSiP : System in PackageCSP : Chip Scale PackageMCM : Multi Chip ModelWLP : Wafer Level PackagePoP : Package on Package3D TSV : Through-Silicon ViaCOB : Chip On BoardFlip ChipSIMM : Single In-line Memory ModuleDIMM : Dual In-line Memory ModuleWaferLeadframeSolder ballsbonding wireball bondingwedge bondingpinsDRAMEEPROMeMMCEPROMFIFOF-RAMManaged NANDMemory ControllersNAND FlashNOR FlashNVRAMSRAMAmber LEDBlue LEDGreen LEDIR LEDOrange LEDPink LEDPurple LEDRed LEDViolet LEDYellow LEDWhite LEDUV LEDBi-color LEDTri-color/RGB LEDRGBW LEDWhite CoB LEDlaser diodeActive FilterAmplifier ICsAudio ICsChipsetsClock & Timer ICsCommunication & Networking ICsCounter ICsData Converter ICsDigital Potentiometer ICsDriver ICsEmbedded Processors & ControllersEqualizersInterface ICsLogic ICsMemory ICsMultimedia ICsOptocouplers / PhotocouplersPower Management ICsProgrammable Logic ICsSecurity ICs / Authentication ICsSwitch ICsWireless & RF IcsCPLD – Complex Programmable Logic DevicesCPU – Central Processing UnitsDigital Signal Processors & Controllers – DSP, DSCEEPLD – Electronically Erasable Programmable Logic DevicesFPGA – Configuration MemoryFPGA – Field Programmable Gate ArrayMicrocontrollers – MCUMicroprocessors – MPUProcessors – Application SpecializedRF System on a Chip – SoCSPLD – Simple Programmable Logic DevicesSystems on a Chip – SoCDiodes & RectifiersDiscrete Semiconductor ModulesThyristorsTransistorsTransistors RFWireless & RF ICsPIN DiodesAudio SensorsBiomedical SensorsCapacitive Touch SensorsCurrent SensorsEncodersEnvironmental SensorsFlow SensorsForce Sensors & Load CellsLinear Displacement SensorsLiquid Level SensorsMagnetic SensorsMotion & Position SensorsOptical SensorsPressure SensorsProximity SensorsSensor Development ToolsSensor Hardware & AccessoriesTemperature Sensorssilicon base dieGaAs base dieGaP base dieGaIn base dieInP base diecopper alloy lead framegold bonding wiresilver bonding wirecopper alloy bonding wireAluminum alloy bonding wireball-ball bondingball-wedge bondingPTH (pin thru hole) solderingSMT (surface mount technology)DCA (direct circuit attached)FC (flip chip)SoC (system on chip)DIP (dual in-line package)PDIP (Plastic DIP)Cerdip (ceramic DIP)DIC (dual in-line ceramic package)DIL (dual in-line)SDIP (Shink DIP)SIP (Single in-line package, SIL)SIMM (single in-line memory module)DIMM (double in-line memory module)QUIP (quad in-line package)QFP (quad flat package)BQFP (QFP with bumper)FQFP (fine QFP)MQFP (metric QFP)MQUAD (metal QFP)LQFP (low profile QFP)L-QUAD (ceramic QFP)Cerquad (ceramic QFP)PGA (butt joint pin grid array)MSP (mini square package, QFI)BGA (ball grid array)DFP (dual flat package)DSO (dual small outline)DICP (dual tape carrier package)OPMAC (over molded pad array carrier)LCC (leadless chip carrier, QFN)PLCC (plastic LCC)JLCC (J-leaded chip carrier)CLCC (ceramic leaded chip carrier)LGA (land grid array)LOC (lead on chip)PCLP (PCB leadless package)SOP (smaller outline package)TSOP (Thin SOP)MFP (mini flat package, SOP, SSOP)HSOP (heat sink SOP)COB (chip on board)SiP (System in Package)PoP (package on package)Stacked MCP (Multi-chip package)MCM (Multi-chip-module)TSV (thru silicon vias)FR-2phenolic paperFR-4woven fiberglassIMSInsulated metal substrateflexible printed circuitcopper foil laminatedthin stiffenerG-10G-11CEMPTFEPIPanelizationcopper patterningsilk screen printingphotoegravingPCB millingLaser resist ablationLaser etchingelectroplatedlaminationdrillingplating and coatingsolder resist applicationbare board testingglass transition temperaturetensile strengthshear strengththermal expansiondielectric constantloss tangentdielectric breakup voltageleakage currenttracking resistancemositure absorptionSemiconElectronicsSemiconductorIC Failure AnalysisPCBToolMoldValveBearingPipeLaser MicromachiningLaser DecapsulationLaser DecapLaser DeliddingLaser cross sectionLaser Gel RemovalLaser Via DrillingLaser FineEngravingLaser MicroFormingLaser StereoLithographyLaser Shock PeeningLaser DrillingLaser TaperingLaser BoringLaser PiercingLaser dicingLaser trimmingLaser BoreLaser TaperLaser PierceLaser diceABS, Acrylonitrile-Butadiene-StyreneASA, Acrylic-styrene-acrylonitrileCA, CelluloseAcetateCAP, CelluloseAcetatePropionateCB, CelluloseButyrateCP, CellulosePropionateCTFE, PolychlorotrifluoroethyleneEAA, EthyleneAcrylicAcid, TPEAE, EthyleneAcrylicEster, TPECTFE, Ethylene-chlorotrifluoroeethyleneEMA, EthyleneMethylAcrylate, TPEMAA, EthyleneMethacrylicAcidENBA, EthyleneN-ButylAcrylate, TPEpoxy, Polyepoxide, PlaskonETFE, CopolymerofethyleneandchlorotetrafluoroethyleneEVA, EthyleneVinylAcetate, TPEVOH, EthyleneVinylSilane, TPFEP, Fluorinatedethylene-propyleneFuran, FuranHDPE, HighdensityPolyethyleneHIPS, HighimpactpolystyreneIONOMER, lonomerLCP, LiquidcrystalpolyesterLDPE, LowdensityPolyethyleneLLDPE, LinearLowdensityPolyethyleneMaleimide, BismaleimideMDPE, MediumdensityPolyethyleneMF, MelamineformaldehydePA, Nylon, Polyamides, ZytallPA11, Polyamide11PA12, Polyamide12PA4, 6, Polyamide42100PA6, Polyamide6PA6, 10, Polyamide42165PA6, 12, Polyamide42167PA6, 6, Polyamide42161PA6, 9, Polyamide42164PAI, Polyamide-imidePBT, Polybutyleneterephathalate, Valox, VandarPC, Polycarbonate, LexanPC, ABS, Polycarbonate, AcrylonitrileButadieneStyrenePCT, PolycarbonatehexandimethanolTerephthalatePE, PolyethylenePE, ABS, Polyethylene, AcrylonitrileButadieneStyrenePEC, Polyethylene-ChlorinatedPEEK, PolyetheretherketonePEEK, PolyetheretherketonePEI, PolyetherimidePEI, Ultem, PolyetherimidePES, Polyester, PolyethersulfonePET, Polyethyleneterephathalate, Rynite, MylarPETG, Glycol-PolyethyleneterephathalatePF, Phenolics, phenolformaldehydesPFA, PerfluoroalkoxyPI, PolyimidePK, PolyketonePLA, PolylacticacidPlastarch, PlastarchmaterialPMMA, Acrylic, Lucite, PolymethylmethacrylatePMP, PolymethylpentenePolyimide, PolyimidePolyolefin, PolyolefinPolysulfone, PolysulfonePOM, PolyacetalPP, Polypropylene, TPPPA, PolyphthalamidePPE, PolyphenyleneEtherPPO, PolyphenyleneOxidePPS, PolyphenyleneSulfidePS, Polystyrene, TPPSF, Polysulfone, TPPTFE, Teflon, PolytetrafluorothylenePU, Polyurethane, TPPVC, PolyvinylChloride, TPPVDC, Saran, PolyvinylidenechloridePVDF, PolyvinylidenefluorideSAN, AS, Styrene-AcrylonitrileSB, Styrene-ButadieneSilicone, SiliconeSMA, StyreneMaleicAnhydrideTPE, ThermoplasticElastomer, TPETPO, ThermoplasticPolyolefin, TPOUF, Urea-formaldehydecarbonresinCoatedfiberPCBFibersubstratePCBCastironsSpecified mechanical property steelscarbon and alloy steelsH-steelsCast steelsstainless steelsTool steelswrought and cast steelCadmium coated steelOxide coated steelSpring steelSurgical steelharden steelstress proof steelUntreated steelWelding filler metalsBrushed Cast AluminumClear Anodized AluminumBlack Oxided AluminumGalvanized AluminumPainted Aluminumbare brassLacquer coated brassbronzebare coppernickel coated coppercadmium platedchromium platedNickel platedMagnesiumbismuththoriumzirconiumlithiummanganeseleadtinantimonygoldKovar, Iron Cobalt AlloyssilverplatinumiridiumosmiumPalladiumRhodiumrutheniumbariumMolybdenum AlloysNiobium, Columbium AlloysTantalum AlloysCobalt AlloysTitanium AlloysZirconium AlloysRare Earth Metals AlloysLow-melting Metals AlloysZinc AlloysInPGaAsSiglassfillerSapphireFusedSilicaPyrexEMC epoxy mould compoundpoxy resinPE PolyethylenePI PolyimidePOM PolyacetalPMMA AcrylicPC PolycarbonateABS Acrylonitrile-Butadiene-StyreneChemical conversion filmElectroless plating,Chemical OxidationPaintingplating,electro-platingAnadizationElectrophoresisElectrostatic sprayingImpact platingPolishedbrushedPVDCVDIon ImplantationSuper-harden TechnologyHotDipplatingthermal sprayingThermal StampingChemical heat treatmentWelding SurfacingAnnealing,Stress ReliefingNormalizingquenching,HardeningTemperingChemical Surface TreatmentElectrochemical Surface TreatmentMechancial Surface TreatmentVaccum Surface TreatmentThermal TreatmentSteel Thermal Treatment

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