Sample NameUSC (TOSHIBA DIODE)
Cycle Time (s)30s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 1064 nm

Obtained the high quality of decapsulation by using the medium current and the lower laser energy density.

Sample NameUS6 (TOSHIBA Small-signal MOSFET)
Cycle Time (s)29s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 1064 nm

Obtained the high quality of decapsulation by using the medium current and the lower laser energy density.

Sample NameUF6 (TOSHIBA LowON Res MOSFET)
Cycle Time (s)25s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 1064 nm

Obtained the high quality of decapsulation by using the medium current and the lower laser energy density.

The system we used:

BrandFALIT
ModelDUO
Laser SystemICO 50
WorkstationWork Bench Top
Accessories/Spare PartsN/A

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