Sample NameUSC (TOSHIBA DIODE)
Cycle Time (s)39s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 355 nm

Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density.

Sample NameUS6 (TOSHIBA Small-signal MOSFET)
Cycle Time (s)29s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 355 nm

Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density.

Sample NameUF6 (TOSHIBA LowON Res MOSFET)
Cycle Time (s)44s
Laser Processing TypeMicromachining
IndustrySemiconductor/Electronics/PCBs
MaterialComposite

Application Notes:

Workpiece Material: Epoxy Mold Compound (EMC)
Trail Laser Wavelength: 355 nm

Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density.

The system we used:

BrandFALIT
ModelDUO
Laser System8Watt UV Laser
WorkstationWork Bench Top
Accessories/Spare PartsN/A

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