Laser Application for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 39s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type…

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Laser Application for UD (TOSHIBA Small-signal MOSFET), TSOP6F (TOSHIBA Small-signal MOSFET), S-mini (TOSHIBA BIPOLAR TRANSISTORS)

Sample Name UD (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Molding Compounds Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name TSOP6F (TOSHIBA Small-signal MOSFET) Cycle Time (s) 33s Laser Processing Type…

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Laser Application for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 30s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the lower laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type…

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Laser Application for UD ((TOSHIBA Small-signal MOSFET)), TSOP6F ((TOSHIBA Small-signal MOSFET)), S-mini (TOSHIBA BIPOLAR TRANSISTORS)

Sample Name UD ((TOSHIBA Small-signal MOSFET)) Cycle Time (s) 35s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the higher laser energy density. Sample Name TSOP6F ((TOSHIBA Small-signal MOSFET)) Cycle Time (s) 26s Laser Processing…

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Laser Application for SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), CST(TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), SOD (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode)

Sample Name SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode) Cycle Time (s) 19s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the medium current and the lower laser energy density. Sample Name CST(TOSHIBA ESD Suppressors/TVS Diodes ESD protection…

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Laser Application for SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), CST (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), SOD (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode)

Sample Name SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode) Cycle Time (s) 4s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the lower laser energy density. Sample Name CST (TOSHIBA ESD Suppressors/TVS Diodes ESD…

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FALIT – GEL Laser Micromachining for Sample 1(LUMILEDS), Sample2(LEDTEEN-H1511), Sample3

Sample Name Sample 1(LUMILEDS) Cycle Time (s) 58s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Silica Gel Trail Laser Wavelength:10.6 um Obtained the high quality of decapsulation by using the medium current and the lower laser energy density. Sample Name Sample2(LEDTEEN-H1511) Cycle Time (s) 70s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal…

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Laser Application for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 39s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type…

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Laser Application for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 39s Laser Processing Type Micromachining Industry Semiconductor/Electronics/PCBs Material Composite Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type…

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Application Spotlight: BGA to PCB Adhesion Inspection with FALIT® Duo™ Cross-Section Laser

Pioneering and Advancing Laser Cross-section Technology Our latest laser cross-sectioning technology brings to the industry the ability to perform cross-sections without the need for post-processing, in many cases. Control Laser pioneered the ability to cross-section a semiconductor many years ago and we continue to pursue the advancement of this technology for our customers. With hundreds of FALIT® systems in labs…

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