InstaMark – Laser Micromachining for SealMaster Tag

Sample Name SealMaster Tag Cycle Time (s) 0.5 Seconds Laser Processing Type Laser Micromachining Industry Packaging/Labeling/Tags/Signs/Printing Material Metal Application Notes: Aluminum TagThe system we used:BrandInstaMarkModelLaser SystemF20WorkstationAccessories/Spare Parts7in Lensmedical device packagingbulk chemical packagingover-the-counter drug packagingpharmaceutical packagingretail foodpackagingtobacco packagingmilitary materiel packagingbarcodeQR codematrix barcodeUPCRFIDrecycle Green DotCE markingflammable liquidexplosivesThis Way UpFragile materialKeep away from watertincanglass bottlePET bottlestraw molded pulppaperboard boxcorrugated boxcartoonbag-in-boxpalletcontainershrink filmseal bandshrink wrapheat…

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InstaMark – Laser Marking / Engraving for Bearing CU4227, Bearing 4385, Bearing CU3202, CU3322

Sample Name Bearing CU4227 Cycle Time (s) 12.12 Seconds Laser Processing Type Laser Marking / Engraving Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Steel Sample Name Bearing 4385 Cycle Time (s) 22.620 Seconds Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: With Bar Code 31.53 Seconds and the Logo was omitted from cycle time study Sample Name Bearing…

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InstaMark – Laser Marking / Engraving for Brass Tag 1.5 Inch, Brass Tag 2 Inch

Sample Name Brass Tag 1.5 Inch Cycle Time (s) 30.3 Seconds Laser Processing Type Laser Marking / Engraving Industry Jewlery/Watch/Trophy/Sports Gears Material Metal Application Notes: F20 with a 7in Lens. The issue was getting a good dark mark with a fast cycle time. Marking time for the 1.5 inch tag was 30.3 Seconds and for the 2 inch tag it…

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FALIT – ICO Laser Micromachining for BGA 1.1, BGA 1.2, BGA 1.3, BGA 1.4, SOT 2.1, SOT 2.2, SOT 2.3, SOT 2.4

Sample Name BGA 1.1 Cycle Time (s) 39 Laser Processing Type Laser Micromachining Industry Semicon/Electronics/PCBs Material Plastics/Resins Application Notes: Big decap area. 5 passes. (5 same medium energy passes) Sample Name BGA 1.2 Cycle Time (s) 27 Laser Processing Type Laser Micromachining Industry Semicon/Electronics/PCBs Material Plastics/Resins Application Notes: Small decap area. 6 passes. (4 medium energy passes, 2 lower energy…

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FALIT – DUO Laser Micromachining for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 39s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing…

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FALIT – DUO Laser Micromachining for UD (TOSHIBA Small-signal MOSFET), TSOP6F (TOSHIBA Small-signal MOSFET), S-mini (TOSHIBA BIPOLAR TRANSISTORS)

Sample Name UD (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Molding Compounds Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the higher current and the higher laser energy density. Sample Name TSOP6F (TOSHIBA Small-signal MOSFET) Cycle Time (s) 33s Laser Processing…

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FALIT – DUO Laser Micromachining for USC (TOSHIBA DIODE), US6 (TOSHIBA Small-signal MOSFET), UF6 (TOSHIBA LowON Res MOSFET)

Sample Name USC (TOSHIBA DIODE) Cycle Time (s) 30s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the lower laser energy density. Sample Name US6 (TOSHIBA Small-signal MOSFET) Cycle Time (s) 29s Laser Processing…

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FALIT – DUO Laser Micromachining for UD ((TOSHIBA Small-signal MOSFET)), TSOP6F ((TOSHIBA Small-signal MOSFET)), S-mini (TOSHIBA BIPOLAR TRANSISTORS)

Sample Name UD ((TOSHIBA Small-signal MOSFET)) Cycle Time (s) 35s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the higher laser energy density. Sample Name TSOP6F ((TOSHIBA Small-signal MOSFET)) Cycle Time (s) 26s Laser…

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FALIT – DUO Laser Micromachining for SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), CST(TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), SOD (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode)

Sample Name SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode) Cycle Time (s) 19s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 355 nm Obtained the high quality of cross-sectioning by using the medium current and the lower laser energy density. Sample Name CST(TOSHIBA ESD Suppressors/TVS Diodes ESD…

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FALIT – DUO Laser Micromachining for SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), CST (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode), SOD (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode)

Sample Name SL2 (TOSHIBA ESD Suppressors/TVS Diodes ESD protection diode) Cycle Time (s) 4s Laser Processing Type Laser Micromachining Industry Tools/Molds/Valves/Bearings/Pipe Material Metal Application Notes: Workpiece Material: Epoxy Mold Compound (EMC) Trail Laser Wavelength: 1064 nm Obtained the high quality of decapsulation by using the medium current and the lower laser energy density. Sample Name CST (TOSHIBA ESD Suppressors/TVS Diodes…

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