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FALIT® IC Laser Decapsulation System for Failure Analysis 2006

The FALIT® IC Laser Decapsulation System for failure analysis has been used since 2006 to reveal bonding wires and dies.

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FALIT® Gel Laser Decapsulation, Semiconductor Failure Analysis Inspection Tool since 2004

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Automated Laser System Engineering Services – Laser Wire Stripping and Cutting for aerospace app

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Tactical ArmsMark® – Embossing-3d-laser-engraving-knife-texturing

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AutomotiveMark® – laser deep engraving and marking auto parts

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