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FALIT® IC Laser Decapsulation System for Failure Analysis 2006

The FALIT® IC Laser Decapsulation System for failure analysis has been used since 2006 to reveal bonding wires and dies.

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FALIT® Gel Laser Decapsulation, Semiconductor Failure Analysis Inspection Tool since 2004

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RETINA® DEMO automated laser micromachining production – IC re-bonding, repackaging

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Tactical ArmsMark® – Creative Laser Embossing

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MedicalMark® – Micron level laser marking defibrillators

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