The RETINA® Lab Laser System

The Retina Lab Laser System is a fully integrated, compact system designed for Lab R&D use. The UV laser source means the system has an extremely long life-cycle and minimal maintenance costs. The system is maintenance free apart from the filter pad and processing lens.

The combination of a high-quality galvo scanner and a UV laser produces highly precise marking results in short marking time. This, together with the LMS 3.1 marking software and the available interfaces, provides a flexible and productive marking solution of the highest quality standards.

The FDA 21 CFR Class I safety enclosure is designed to meet strict FDA safety guidelines while being easy to use and nonobtrusive.

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FEATURES

Safe Class I Enclosure

Class I enclosure allows the operator to work without wearing the additional protective eye glasses and suit.

And the design of the magnetic interlock will stop lasing as long as the door is opened.

Powerful High Speed and Precious Lasing

Taking advantage of the photon energy of the 355 nm wavelength (cold marking), the system is capable of achieving 3.9 μm spot sizes and work spaces in excess of 200 x 200 mm. The system can also achieve up to 10,000 mm/s scanning speed with high quality galvo scanner.

Compact Design

Your all-in-one solution, no separate controller unit and computer needed.

Professional and user-friendly software

The LMS 3.1 was developed to bring out the high performance of the in an easy to use interface. Even users with no experience in laser programming can easily begin operating very complex setups.

SPECIFICATION

Laser	Laser	Pulsed UV Laser, Maintenance Free
	Wavelength	355 nm
	Pulse Width	30 ns
	Beam Quality	M² < 1.2
	Pulse to Pulse Stability	< ± 10%
	Beam Circularity	> 85%
	Beam Divergence Full Angle	< 0.5 mrad
	Maximum Average Output Power	3 W
	Maximum Pulse Energy	100 µJ
	Pulse Repetition Rate	10-50 kHz
	Cooling Requirement	Water Cooling
Workstation	Overall Dimensions (L × W × H)	842 × 513 ×934 mm (33.2″ × 20.2″ × 36.8″)
	Dimension of Opening (W × H)	686 × 518 mm (27.01″ × 20.39″)
	Door	Manual
	Maximum Workpiece Size	437 × 277 mm (17.20″ × 10.91″)
	Maximum Load	25 kg (55.125 lbs.)
	Table Size	Aluminum Table 710 × 412 mm (27.95″ × 16.22″)
	Z-axis	Manual Z-axis (Optional Automatic Door)
	Z-axis Travel Distance	50 mm (1.97″), 150 mm (5.91″), 220 mm (8.66″)
Galvo-System	Lens/Focal Length	F-60	F-100	F-167	F-295	F-330
	Marking Area [mm x mm]	22 x 22	50 x 50	90 x 90	172x 172	203 x 203
	Spot Size	~ 3.9 µm	~ 5 µm	~ 10.8 µm	~ 13 µm	~ 15.3 µm
	Scanning Speed	10,000 mm/s (472.44 inches/s)
Control	Computer	Intel NUC 5i5MYBE, 8 GB RAM, HDD 200 GB, Windows® 10
	Interface	USB 3.0
	Software	LMS 3.1: Professional Laser Marking Software
Installation/Laser Safety	Weight	48 kg (105.84 lbs.) (without Chiller, Monitor, Keyboard and Mouse) Monitor: 3 kg (6.615 lbs.), Chiller: 23 kg (50.715 lbs.)
	Ambient Conditions	Operating Temperature Range +15 to +30°C (50 to 86°F) Relative Humidity Maximum 80%, Non-condensing
	Electrical Requirements	100 – 230 VAC,1 Phase, 15A, 50/60 Hz
	Power Consumption	< 600 W (Including Monitor and Chiller)
	System Protection	Marking Head: Sealed against Spray Water (IP 54) Laser Unit: Dust Protected (IP20)
	Laser Class	Laser Class I

APPLICATION

HDPE Laser Marking

Due to the short wavelength of UV laser, the RETINA system can marking on some high polymer material which other kinds of laser are not able to mark on, such as, HDPE.

Micro Drilling

With the advantage of short wavelength, the UV can get smaller spot size than other kinds of laser source.

Micro Machining

Cold UV machining minimizes the heat affected zone (HAZ), improving machining accuracy.

PCB Cutting

UV laser cutting not only eliminates the effects of mechanical stress that occur during cutting such as burring, deformation, and damage to circuit components, but also reduces the effects of thermal stress found with other laser options, such as CO2 cutting.